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I. C 磨 字 機

I. C Letter Grinding Machine

特 點：

1.徹底磨除IC表面字體,防止機板被仿冒

2.採用自動入料、收料,不須經人手接觸,防止靜電干擾

3.特殊砂輪片研磨,表面不發(fā)燙,可微調研磨深度

4.裝有砂輪校正器,可隨時校正砂輪片平面度

5.體積小,生產效率高,一臺可抵5個作業(yè)員

6.適用DIP型IC,SMD型SOP SOJ PLCC,以及電晶體型TO22 TO-36 TO-26等IC磨字

Features ：

1.To be able thoroughly grind off the letters on the surface of IC to prevent the circuit board from being .counterfeited.

2.To use automatic material feeding and recovering without hand touching the material to prevent form electrostatic interference.

3.To grind with special grinding wheel plate without causing surface being heated, the depth of the grinding may be, micro-adjusted.

4.To fit with diamond rectify to adjust the plane of the grinding wheel plate at any time when necessary.

5.With small volume and high production efficiency, the productivity of one machine is equivalent to five skilled labors.

6.The machine is suitable for D. I .P IC type and S.M.D. IC type (SOP. SOJ and PLCC type etc.